Amy Fleischer, Ph. D.

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    Director of the NovaTherm Research Laboratory

    Professor and Chair
    Department of Mechanical Engineering

    Villanova University
    800 E. Lancaster Ave
    Villanova, PA 19085
    Phone: (610) 519-4996

    Amy Fleischer received her Ph.D. in Mechanical Engineering from the University of Minnesota in 2000. She is currently a Professor and Department Chair of Mechanical Engineering at Villanova University.  She is also Director of the NovaTherm Research Laboratory. Her research interests include the broad topics of sustainable energy system design and thermal management of electronic systems. Recent research projects included energy storage in phase change materials, waste heat recovery from data centers, development of energy absorbing building materials, development of nano-enhanced materials including graphite nanofiber thermal interface materials, jet impingement, porous media heat sinks and boiling heat transfer. Over the past 14 years she has been a part of more than 30 funded grants for a total budget of approximately $4.2 million. Grant funding has come from a variety of sources including  federal agencies, industry /industrial consortia, state agencies or programs, and national labs.

    Dr. Fleischer is recognized as a world-wide expert in thermal-fluid system design. She was elected and served as Chair of the ASME Heat Transfer Division K-16 Technical Committee on Electronics Thermal Management from 2009-2011. This committee is the focal point for ASME activities in the area of Thermal Management of Electronics. The committee is comprised of leading researchers from both academics and industry and strives to provide leadership in the dissemination of technical information, the transfer of technology, and the interchange of ideas between industrial, academic and government institutions involved in the thermal management in electronics packaging. Dr. Fleischer also served on the Executive Committee of the ASME Electronics and Photonics Packaging Division (2009-2011).

     Research led by Dr. Fleischer on the recovery and reuse of waste heat from large data  centers was selected for inclusion in the 2014 NSF Compendium of Industry-Nominated Technology Breakthroughs. The compendium provides an overview of the outstanding work coming out of National Science Foundation (NSF) Industry/University Cooperative Research Centers (I/UCRC), and is provided to interested members of Congress, White House and congressional staffers, and members of official NSF committees of visitors. All entries in this compendium were nominated by industry scientists and "exemplify the countless collaborative efforts of university and industry scientists and the economic impacts of the resulting research."

    Dr. Fleischer was recognized as the ASME Electronics and Photonics Packaging Division (EPPD) 2010 Women Engineer of the Year  and was awarded the 2011 ASME K-16/ EPPD Clock Award in recognition of her outstanding and continuing contributions to the science and engineering of heat transfer in electronics. She is an Associate Editor of the Journal of Electronic Packaging and is joining the editoral board of the ASME Journal of Heat Transfer as an Associate Editor in July 2014. She is a Fellow of ASME.

    Dr. Fleischer has supported 16 graduate students to degree completion and worked with 35 undergraduate researchers. She is the author of more than 80 technical peer reviewed papers,  has edited one book, Thermes 2007: Thermal Challenges in Next Generation Systems, and is the author of Phase Change Materials:Fundamentals and Appications published by SpringerBriefs in 2015. She held a visiting position at the Fraunhofer Institue for Reliability and Microintegration in Berlin during the Fall 0f 2004.

    Dr. Fleischer frequently participates in the organization of leading conferences and workshops. Recent conference organization has included the organization of the graduate student professional development track at InterPACk 2015, serving as Thermal Track co-Chair for Itherm in May 2014, as co-organizer for the Symposium in honor of Richard J. Goldstein, held at the ASME 2013 Summer Heat Transfer Conference and as Co-Chair of the “US-India Workshop: Thermal Management of Electronics”, Mumbai, India, January 7-8, 2010. She has presented more than 60 invited lectures at Universities and workshops around the world including locations in Mumbai and Banglore, India and in Egypt, Switzerland and Ireland.