2012
Steven Miller, Ph.D.,
"Clustering
behavior of Yttrium and scandium dopant ions in
cubic stabilized zirconia electrolytes at high
temperature."
Anthony Rao, MSME, "Installation and
Calibration of Thermal Conductivity Testing
Equipment."
2010
Ryan Ehid, MSME: “Development of Shape-Stabilized Nano-enhanced Phase Change
Material."
2009
Ronald Warzoha, MSME: “A Computational Study on Novel Thermal Management
Techniques for Solid State Current Limiters and their Optimization in Various
Power Loading Schemes and Orientations.” Kireeti Chintakrinda, MSME: "An Experimental Investigation into the
Transient Thermal Management of Electronics Using Phase Change Materials.”
Omar Sanusi, MSME: “An Investigation into the Solidification Effects of
Nanoenhanced Phase Change Material."
2008
Ravi Yakkatelli, MSME, “A Flow Visualization Study of the Jet
Dynamics of a Round Jet Impinging on Foamed Aluminum Porous Medium.”Srikanth Challa, MSME, “Effects of Proximity on Overheating of Adjacent Devices
on Printed Circuit Boards in Forced Convection,”
2007
Venugopal Gandikota, MSME: "Determination of Heat Removal Rate from Advanced Heat Sinks in Two-Phase Flow," currently with Vanguard Group.
Patrick Kirby, MSME: Thermal Interactions in Free Convection from Two Unequally Powered Discrete Heat Sources on a Vertical Printed Circuit Board."
2006
Harish Chengalvala, MSME: “Evaluation of a Carbon-Fiber Brush Heat Sink in Two-Phase Boiling Flow,” currently with Dade Behring.
Brian Comber, MSME: “Thermal Proximity Effects of Packaged RF High Power Amplifier Discretes,” currently with Orbital Sciences Corporation.
2005
Sharareh R. Nejad, MSME: “Jet Impingement Cooling of Heated Plates and Raised Pedestals Representing Microchip Arrangements,” currently with Schoor DePalma Engineers and Consultants.
Jared Harvest, MSME: “Effects of Proximity on Overheating of Adjacent Devices on Printed Circuit Boards,” currently with Fluent, Inc. as IcePak Support Engineer.
Thomas Kopec, MSChE: “Phase Change Materials With Carbon Nanofibers For Thermal Management Of Electronics,” currently with Integra LifeSciences as a Product Development Associate Engineer.
Alumni Undergraduate Students
Chris Burns,
Class of 2012, “Data Reduction of Thermal Cycling Experiments of
Shape-Stabilized Phase Change Materials.Tim Thomas,
Class of 2012, “Data Reduction of Thermal Cycling Experiments of
Shape-Stabilized Phase Change Materials.”
Sean
McIntosh, class of 2011, “Development of a vacuum assist system to enhance PCM
penetration into carbon foam.”
Caitlin
McEntee, class of 2011, “Heat Transfer from a Porous Foam Heat Sink to an
Impinging Round Jet.”
Kelsi
Bendenelli, class of 2011, “Heat Transfer from a Porous Foam Heat Sink to an
Impinging Round Jet.”
William
McCann, class of 2010, “Development of a vacuum assist system to enhance PCM
penetration into carbon foam.”
Elizabeth
DiBella, class of 2010, “Fluid Dynamics of an Round Jet Impinging on a Porous
Media”
Brian
McManus, class of 2010, “Investigation of conductivity enhanced PCMs as a
thermal interface material.
John McCloskey,
class of 2010, “Determination of the thermal properties of PCM enhanced window
panels for energy efficient buildings.”
Ian Azerdo,
class of 2009, “Fluid Dynamics of an Round Jet Impinging on a Porous Media”
Patrick
McGrath, class of 2008, “Flow Mechanics of an Air Jet Impinging on a Pedestal”
Ron Warzoha,
class of 2008, “Thermal analysis of a 69 kV Solid State Current Limiter.”
Erik Martin,
class of 2008, “Design of a Chemical Vapor Deposition Chamber for Thin Film
Deposition.”
Neal Dillon,
class of 2008, “Design of a High Heat Flux Thermosyphon.”
Patrick Loerch,
class of 2008, “Numerical Analysis of the Thermal Impact of Solder Voids and
Correlation with Thermal Images.”
Adriano Hauck,
class of 2008, “Effective Thermal Conductivity Modeling of Thermal Vias.”
Patrick
McGrath, class of 2008, “Flow Mechanics of an Air Jet Impinging on a Pedestal”
John Duda, class of 2007: "Flow Mechanics of an Air Jet Impinging on a Pedestal."
Francis Lagor, class of 2006: “Flow Mechanics of an Air Jet Impinging on a Pedestal,” currently Ph.D. student at the University of Pennsylvania.
Michael Nyhan, class of 2005: “Mitigation and Detection of Thermal Signatures of Unmanned Surface Vehicles,” currently with Fluor Corportation as a Process Engineer.
Brian Comber, class of 2005: “Thermal Proximity Effects of Packaged RF High Power Amplifier Discretes,” (also became a graduate student - see above) currently with Orbital Sciences Corporation.
Matthew Voorhees, class of 2005: “Use of Infrared Thermography in Thermal Management of Electronics,” currently with Enercon Services.
Kerry Kamon, class of 2005: “Use of Infrared Thermography in Thermal Management of Electronics,” currently with Lockheed Martin and a graduate student pursuing a MSEE at the University of Pennsylvania.
Adrienne Darr, class of 2004: “Experimental Investigation of Phase Change Materials for Thermal Management of Naval Electronics,” currently with Naval Surface Warfare Center, Carderock Division.
Anthony Reindl, class of 2004: “Natural Convection from Two Heat Sources Maintained at Different Temperatures on Multiple Printed Circuit Boards,” currently with L3 Communications Electronics Division.
Christina Turka, class of 2003: “Natural Convection from Two Heat Sources Maintained at Different Temperatures on Multiple Printed Circuit Boards,” received MSME from University of Delaware, 2005, currently with Rohm and Haas Electronic Materials Division.
Craig Iwano, class of 2003: “Natural Convection from Two Heat Sources Maintained at Different Temperatures on Multiple Printed Circuit Boards,” currently with Materials, Research and Design, Inc.
Jared Harvest, class of 2003: “Natural Convection from Two Heat Sources Maintained at Different Temperatures on Multiple Printed Circuit Boards,” (also became a graduate student - see above) currently with Fluent, Inc. as IcePak Support Engineer.
Kimberly (Krug) Fogarty, class of 2002: “Natural Convection from Two Heat Sources Maintained at Different Temperatures on a Single Printed Circuit Board,” currently with BASF.
Thomas Kopec, class of 2002: “Natural Convection from Two Heat Sources Maintained at Different Temperatures on a Single Printed Circuit Board,” (also became a graduate student - see above) currently with Integra LifeSciences as a Product Development Associate Engineer.
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